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Wire Bond Pull Test

MIL-STD-883 Method 2011.9 — Destructive Bond Pull Test for Gold Wire

Test Levels

1X

Standard test level

1.25X

Enhanced reliability

2X

High reliability

Note: Values shown are minimum pull strengths for gold (Au) wire per MIL-STD-883 Method 2011.9. The test measures the force required to break or lift the wire bond.

Open Printable Test Form »

Quick Calculator

Select Wire Diameter:

Wire Size: Test Level:

Minimum Pull Strength Required:

- gf | - mN | - cN

Gold Wire - Minimum Pull Strength (gf)

Wire Diameter (mil)	Wire Diameter (µm)	1X (gf)	1.25X (gf)	2X (gf)
0.6	15	1.5	1.9	3.0
0.7	18	2.0	2.5	4.0
0.8	20	2.4	3.0	4.8
1.0	25	3.0	3.8	6.0
1.2	30	4.0	5.0	8.0
1.3	33	4.5	5.6	9.0
1.4	36	5.0	6.3	10.0
1.5	38	5.5	6.9	11.0
1.6	41	6.0	7.5	12.0
1.8	46	7.0	8.8	14.0
2.0	51	8.0	10.0	16.0

MIL-STD-883 Method 2011.9 Notes:

• Gold wire minimum pull strength at 1X level = 3.0 gf per mil of wire diameter
• 1.25X level = 1X value × 1.25
• 2X level = 1X value × 2
• Test must break wire or lift ball/wedge bond - peel failures require evaluation
• Wire must be pulled at midpoint between bonds at 90° to substrate

Unit Conversion Reference

gf (gram-force)	mN (millinewton)	cN (centinewton)
1 gf	9.807 mN	0.981 cN
3 gf	29.42 mN	2.942 cN
5 gf	49.03 mN	4.903 cN
10 gf	98.07 mN	9.807 cN

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